Molex Experts Showcase Complete High-Speed interconnect Solution at DesignCon 2012
1/30/2012
Technical papers and product demonstrations highlight broad range of Molex expertise and solutions including I/O, backplane, mezzanine and power
LISLE, Ill. - January 20th, 2012 - Molex Incorporated will bring its proven expertise in high-speed, high-density interconnect technology to DesignCon 2012, January 30 - February 2, Santa Clara, CA. At the show, Molex experts will participate in several technical paper presentations that feature new interconnect design developments. Additionally, the team will showcase the company's interconnect solutions by displaying a range of products and conducting several live demonstrations in booth 109.
Technical Paper Presentations
The sessions highlight specific Molex technical and application expertise:
EMC/EMI Correlation Study for 25+ Gbps Systems
Wednesday, February 1, 11:05 - 11:45 a.m.: Peerouz Amleshi, director of signal integrity engineering, Molex, will use a 3D simulation tool to predict EM emission. This study will be done in two phases: far field emission correlation between the model and test results for a fabricated antenna (emission source) and correlation between the model versus test results with the emitter enclosed in a metallic chassis.
De-embedding in High Speed Design
Monday, January, 30, 9:00 a.m. - 12:00 p.m.: David Dunham, director of signal integrity engineering, Molex, will conduct a tutorial that reviews the math behind de-embedding. He will also demonstrate how some of the most common de-embedding functions such as probe tip de-embedding, gating and TRL de-embedding are performed.
System Performance as a Function of Common Mode Metrics
Tuesday, January 31, 11:05-11:45 a.m.: Michael Rowlands, senior electrical engineer, Molex, will focus on system performance as a function of common mode metrics. Using analysis, simulation and measurement, he will estimate the bottom line bit-error-rate of a channel and give a set of common mode performance data.
Product Demonstrations
The demonstrations will take place in Molex booth 109 and showcase the company's commitment to developing next-generation solutions for its customers:
EXTreme Ten60Power™ High-Current and EXTreme LPHPower™ Connectors : Jeff Torres, global product manager, will highlight how these two low-profile power connector systems can provide industry leading current density with reduced airflow restrictions and how airflow can improve the power integrity equation. Attendees can see how airflow affects power supply performance and how Molex connectors enhance system design. For more information please visit www.molex.com/link/ext-power.html.
zQSFP+ and zSFP+: In partnership with Texas Instruments, Molex will showcase its breakthrough 28 Gbps over copper cable transmission technology. Jitendra Mohan, engineering manager, Texas Instruments, and Nate Unger, applications engineer, Texas Instruments, will highlight the advanced signal conditioning performance of TI's retimer technology and show how Molex's zQSFP+ connectors are suitable for enabling 100 Gbps capable interconnects. For more information please visit www.molex.com/link/zqsfp+.html.
NeoScale™ 28 Gbps Speeds: Adam Stanczak, product development manager, will conduct a live demonstration of the recently introduced NeoScale connector, a high speed mezzanine solution that delivers desired signal integrity at 28 Gbps+ data rates. The demonstration will feature an integrated board with a T1 chip and Molex connector. Adam will showcase the product's high signal integrity by utilizing different PCB trace lengths and introducing crosstalk aggressors driven by a Bertscope with bit error rates displayed on a monitor. For more information, please visit www.molex.com/link/neoscale.html.
Impact™ Backplane Connector System: Peter Soupir, product development manager, will demonstrate the design flexibility of the Impact system's available configurations, including new designs such as the Impact Plus 85-Ohm Backplane Connector and Impact Orthogonal Direct Connector, along with information regarding Impact cable and copper-flex assemblies. He will also discuss (or demonstrate) how vertical add-in cards can be mated to horizontal add-in cards on the opposite side without the need for a midplane, improving the use of space and airflow. This architecture can be combined with standard configurations to provide a flexible product design solution. For more information please visit www.molex.com/link/impact.html.
Related Exhibition:
DesignCon 2012
THE event for the semiconductor and electronic design engineering community
1/31/2012 - 2/2/2012
Venue: Santa Clara Convention Center, San Francisco CA, United States
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